BALZERS, Liechtenstein - Thursday, October 3rd 2013
Oerlikon Advanced Technologies, a leading supplier of PVD deposition equipment, has today set a new standard with the CLUSTERLINE® 300 as the first 300mm system worldwide running thin wafer backside metallization (BSM) for power devices in production.
Following the successful qualification by a leading power device manufacturer, Oerlikon has received multiple orders for the CLUSTERLINE® 300 for production of 300mm power devices.
The new developed processes for devices like Metal Oxide Semiconductor Field-Effect Transistors (MOSFETs) offer the same behavior as those qualified on 200mm wafers and enable power device manufacturers to produce devices much more efficiently.
With the CLUSTERLINE® 300, Oerlikon has successfully overcome the significant challenges associated with transitioning the manufacturing of power devices from 200mm to 300mm on thin wafers.
The adaption of 300mm wafer production for power devices requires innovative solutions and the addition of higher degrees of automation and wafer handling capabilities.
Depth of experience
Over 10 years ago Oerlikon qualified the first solutions for 200mm power device manufacturing at customer sites, and today the thin wafer handling and processing capability of the CLUSTERLINE® 200 is the established solution at all major power device manufacturers as well as foundries. Oerlikon has a proven track record of overcoming technology challenges to provide the most innovative solutions that deliver the highest productivity and lowest cost of ownership. Oerlikon’s long term experience with power device production processes was a key element in achieving an accelerated qualification and enabling the successful transition from 200mm to 300mm volume manufacturing.
Oerlikon’s solution for BSM applications – for example Ar/H2 etch, AI, Ti, NiV (Ni), Ag (Au alloy) have been successfully proven in production for extremely thin bare wafers and thin wafers on carriers.
For frontside thick Al processing the CLUSTERLINE® 300 offers enhanced capabilities which incorporates some unique Oerlikon developed IP. One example of this capability is the Ti/TiN Highly Ionized Sputtering (HIS) physical vapor deposition (PVD) modules.
“We are pleased to offer customers a comprehensive solution for 300mm power device manufacturing with the CLUSTERLINE® 300. The platform offers both frontside thick Al and thin wafer backside metallization (BSM) for 300mm power device manufacturing. This announcement is an important endorsement of our solutions on 300mm from a leading power device manufacturer. We look forward to building on this success and continue to focus to deliver the highest productivity, best cost-per-wafer output”, says Andreas Dill, CEO of Oerlikon’s Advanced Technologies Segment.
Contacts
OC Oerlikon Management AG
Burkhard Böndel
Head of Group Communications & IR
T +41 58 360 96 02
F +41 58 360 98 02
pr@oerlikon.com
Oerlikon Advanced Technologies AG
Sven E. Jarby
Head of Marketing & Communications
T +423 388 4878
F +423 388 5426
media.systems@oerlikon.com
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